TRESKY soldering hian formic acid vapor chu nitrogen (HCOOH + N2) nen a hmang dun a, hei hian optoelectronics leh photonics assembly leh interconnect technology-ah hlawkna a pe a ni. Formic acid hian rintlak takin oxides a tihtlem a, flux a ti bo vek bawk. Formic acid hman hian surface wettability tha tak a siam bawk a, complex welding process atan condition tha tak a siam bawk. He module hi eutectic soldering leh thermocompression welding atan hman a ni a, entirnan indium hmangin. Bonding process zawng zawngah hian bubbler an tih hmangin nitrogen-enriched formic acid (HCOOH) an hmang vek a. Nitrogen vapor leh formic acid inzawmkhawm chu treatment chamber-ah controlled takin dahin an la chhuak thin.